Xiaomi Unveils AI Cube Mini PC Powered by Three In-House Chips: Runs 120B Parameter AI Models Locally

Xiaomi has showcased an engineering prototype of a compact computer, the AI Cube Prototype, designed to run heavy language models locally without relying on cloud servers. Inside, the device runs three of the company’s own new-architecture processors simultaneously: Xring O3, O100, and D100.

To demonstrate the system’s capabilities, the company ran two neural networks locally at the same time: a flagship 120-billion-parameter model and a fast 3-billion-parameter model.

An Architecture of Three Specialized Chips

Instead of using a monolithic chip, engineers distributed workloads across specialized dies:

• Xring O3: A 3nm flagship SoC featuring a 10-core CPU, 16-core G2-Ultra NX GPU, 24 billion transistors, and a 200 TOPS NPU with support for LPDDR6 RAM;
• Xring O100: A 6nm AI accelerator built on a 3D Wafer-on-Wafer design with hybrid bonding. The chip delivers 1.22 TB/s of memory bandwidth and generation speeds of up to 330 tokens per second on compact models;
• Xring D100: A 3nm automotive computing processor with 20 CPU cores, 16 NPU cores, and support for up to 160GB of unified memory, capable of holding models with up to 200 billion parameters in memory.

Power Consumption Under 150W and an Aluminum Chassis

According to ITHome, the workstation pairs a fast 3B model for instant UI commands with a deep 120B model for code generation and complex data analysis.

Sustained power consumption for the entire computing system stays under 150W, significantly lower than workstations equipped with discrete GPUs. The PC’s chassis is CNC-machined from a solid block of aviation-grade aluminum and features 33,874 ventilation holes for heat dissipation.

Xiaomi’s Semiconductor Strategy and TSMC Chips

As reported by Reuters, the company has invested over 20 billion yuan (around $3 billion) in developing its custom Xring semiconductor lineup, with its dedicated division now employing 3,000 specialists.

The first commercial device powered by the TSMC-built 3nm Xring O3 processor will be the folding Xiaomi 18 Fold smartphone, set to launch in September 2026. The O100 and D100 chips for autonomous EV driving will move to mass production in 2027.

Xiaomi will announce release timing and pricing for the AI Cube desktop computer at a later date.